Amaoe SWT-2 Stencil

Amaoe SWT-2 Stencil

Stencil Purpose: Stencils are used for the precise application of solder paste to solder pads on a PCB. This solder paste serves as a temporary adhesive that holds surface-mount components (SMDs) in place during the soldering process.

Reballing: Stencils are also commonly used in reballing processes, which involve removing and then re-soldering a component, such as a BGA (Ball Grid Array) chip. The stencil helps apply solder balls to the component's pads with precision.

Compatible Devices: The stencil is likely designed for use with specific models. Each stencil is typically designed to match the component layout of a particular device or series.

Aperture Design: The stencil features a pattern of tiny apertures (holes) that align with the solder pads on the PCB or component. When solder paste is applied over the stencil and pushed through these apertures, it deposits a controlled amount of solder onto the pads.

Stencil Material: Stencils are commonly made from stainless steel or other durable materials to withstand repeated use and exposure to high-temperature soldering processes.

Supported Model:-

QCA6174A

BGA178

IT8528VG

BGA153

BGA200

GP213

X026B601

ROHM992

WCSAX201

M22J9VDC

MARVELL

LPC54S001J

KUS0020203M

SDDPEBKF1128G7

95AG101

1.10E+38

X904163

M17P8V

X904169

QLC1832-898B

ALC3269