Amaoe U-His4 Stencil

Amaoe U-His4 Stencil

Amaoe U-His4 Stencil is used for the precise application of solder paste to solder pads on a PCB. This solder paste serves as a temporary adhesive that holds surface-mount components (SMDs) in place during the soldering process.

Reballing: Stencils are also commonly used in reballing processes, which involve removing and then re-soldering a component, such as a BGA (Ball Grid Array) chip. The stencil helps apply solder balls to the component's pads with precision.

Compatible Devices: The stencil is likely designed for use with specific models. Each stencil is typically designed to match the component layout of a particular device or series.

Aperture Design: The stencil features a pattern of tiny apertures (holes) that align with the solder pads on the PCB or component. When solder paste is applied over the stencil and pushed through these apertures, it deposits a controlled amount of solder onto the pads.

Stencil Material: Stencils are commonly made from stainless steel or other durable materials to withstand repeated use and exposure to high-temperature soldering processes.

Amaoe U-HIS4 BGA Reballing Stencil For Huawei HI3690 Mate30 Mate30Pro MateX Mate20RS Nova6 P40 Honor V30 CPU RAM 

Supported model-

HI6363

HI6526

HI6405

HI6422

6H02T

6H11

6H12

540

HI6D05

429

78191-11

77038

HI6421-V8

BGA200

HI1105

HI6365

HI1103

RAM 376

HI3690

HI 3690 4G

HI9500-V100