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The AMAOE X300P-XB-012 is a professional-grade, precision-engineered BGA (Ball Grid Array) reballing stencil specifically designed for the Vivo X300 Pro smartphone. It is an essential tool for micro-soldering technicians, enabling accurate solder ball placement on motherboard integrated circuits (ICs) and components during complex board-level repairs. Precision Engineering: Manufactured using advanced laser-cutting techniques, the stencil features perfectly aligned holes that ensure uniform solder paste application, which is critical for successful reballing of high-density smartphone chips. Optimal Thickness: The 0.12 mm profile is optimized for professional repair tasks, providing enough rigidity to maintain its shape during repeated heating cycles while remaining thin enough to allow for precise solder mask alignment. Enhanced Repair Success: By providing a stable template for BGA rework, this tool minimizes human error, reduces the likelihood of solder bridges between pads, and helps technicians achieve factory-grade connections on Vivo X300 Pro motherboards. Professional Durability: Built from premium stainless steel, the stencil is designed to withstand multiple high-temperature soldering operations without warping or losing its structural integrity. It is a reusable, cost-effective, and essential asset for any mobile service center or micro-soldering workstation.Overview
Key Features
AMAOE X300P-XB-012
Feature
Specification
Product Name
AMAOE X300P-XB-012 BGA Reballing Stencil
Compatibility
Vivo X300 Pro
Stencil Type
BGA (Ball Grid Array) Small Board Reballing Stencil
Material
High-Quality Stainless Steel
Thickness
0.12 mm
Manufacturing
Precision Laser-Cut Technology
Heat Resistance
High-temperature resistant (ideal for hot air rework stations)
Key Benefit
Ensures accurate solder ball alignment and prevents bridging
Weight
Approx. 0.02 kg
Application
Chip-level repair, CPU, PMIC, and motherboard IC rework
Durability
Reusable, anti-deformation material
| Weight |
0.02 kg |
|---|
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