AMAOE XF5-012 VIVO X Fold5 Stencil is a precision laser-cut BGA stencil designed for accurate IC reballing and chip-level motherboard repair.

Specially engineered for VIVO X Fold5, this stencil ensures perfect alignment and consistent solder ball placement every time.

Made from high-quality stainless steel, it offers excellent heat resistance and long-lasting durability for professional repair use.

Ideal for mobile repair technicians and service centers, helping speed up CPU, PMIC, and chipset reballing jobs.

Ultra-thin and precise design allows clean solder flow, reducing errors and improving repair success rates.

Perfect tool for chip-level smartphone repairing, making advanced motherboard work easier and more efficient.

Designed for compatibility with BGA rework stations and hot air tools used in professional repair labs.

Compact and lightweight stencil that provides high accuracy for foldable phone motherboard repairs.

Helps technicians achieve factory-level reballing quality, saving time and improving productivity.

A must-have professional mobile repair accessory for anyone repairing VIVO X Fold5 devices