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AMAOE 10GA-00009-01/XU9001-009 STENCIL
AMAOE XU9001-009 (10GA-00009-01) BGA Reballing Stencil
The AMAOE XU9001-009 (also referenced by factory code 10GA-00009-01) is a premium, high-precision BGA reballing stencil engineered specifically for advanced motherboard repair and micro-soldering professionals. Manufactured using ultra-grade Japanese steel and processed via advanced laser-cutting tech, this stencil provides unparalleled accuracy for alignment, thermal stability during reflow, and clean solder ball release. It is a critical asset for technicians handling high-density interconnect (HDI) chips, power management ICs (PMICs), CPU/RAM stacks, and RF modules.
Product Specifications & Technical Overview
| Attribute | Specification Details |
| Brand | AMAOE (Original Equipment Manufacturer) |
| Model / Part Number | XU9001-009 / 10GA-00009-01 |
| Product Type | High-Precision BGA Reballing Stencil / Matrix |
| Material Composition | High-grade imported Japanese Stainless Steel (SUS301) |
| Thickness | 0.12mm (Optimized for perfect solder paste volume control) |
| Manufacturing Process | High-precision CNC Laser Chemical Etching |
| Aperture Type | Square-centered with rounded corner geometry (Anti-clogging) |
| Compatibility | Universal/Specific IC Chipsets (Power Management, Audio, Baseband, CPU) |
| Thermal Resistance | High deformation resistance up to 450°C |
| Finish | Electro-polished matte anti-glare coating |
Comprehensive Feature Analysis
1. Premium Japanese Steel (SUS301)
Constructed from selected high-tensile Japanese stainless steel, the stencil features remarkable elastic properties. It can withstand repeated bending and flexing without losing its original flat profile, ensuring a perfectly flush sit on the PCB motherboard during paste application.
2. Advanced Square-Centered Rounded Openings
Unlike traditional circular stencil holes that easily trap solder paste, the XU9001-009 features proprietary square apertures with microscopic rounded corners. This geometry maximizes paste deposit consistency and ensures that 100% of the solder paste releases cleanly onto the BGA pads when lifting the stencil.
3. Optimized 0.12mm Thickness
A critical vector in micro-soldering is avoiding bridging while ensuring adequate ball height. The 0.12mm gauge thickness delivers the ideal volume of solder paste, eliminating the risk of micro-bridging under high-density components and reducing the need for manual post-reflow cleanups.
4. High Thermal Stability & Anti-Bulging
The chemical and structural composition allows the stencil to absorb direct heat from hot air rework stations without severe localized thermal expansion. This minimizes the common issue of the stencil "bowing" or "bulging" mid-process, which typically causes ruined solder joints.
| Weight |
0.020 |
|---|
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