Amaoe X200P-Xb-012 Stencil For Vivo X200 Pro
Stencil Purpose: Stencils are used for the precise application of solder paste to solder pads on a PCB. This solder paste serves as a temporary adhesive that holds surface-mount components (SMDs) in place during the soldering process.
Reballing: Stencils are also commonly used in reballing processes, which involve removing and then re-soldering a component, such as a BGA (Ball Grid Array) chip. The stencil helps apply solder balls to the component's pads with precision.
Compatible Devices: The stencil is likely designed for use with specific models. Each stencil is typically designed to match the component layout of a particular device or series.
Aperture Design: The stencil features a pattern of tiny apertures (holes) that align with the solder pads on the PCB or component. When solder paste is applied over the stencil and pushed through these apertures, it deposits a controlled amount of solder onto the pads.
Stencil Material: Stencils are commonly made from stainless steel or other durable materials to withstand repeated use and exposure to high-temperature soldering processes.
Amaoe X200P-XB-012 Stencil for Vivo X200 Pro – FAQ
Q1: What is the Amaoe X200P-XB-012 stencil used for?
A: The Amaoe X200P-XB-012 stencil is designed for IC reballing and chip-level repairs on the Vivo X200 Pro smartphone. It helps technicians accurately apply solder balls to BGA chips like the CPU, RAM, and power ICs.
Q2: What does “X200P-XB-012” mean?
A:
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X200P refers to compatibility with the Vivo X200 Pro.
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XB indicates the chip series or type (commonly related to the CPU or baseband).
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012 specifies the solder ball diameter of 0.12mm, ideal for fine-pitch components.
Q3: Which components of the Vivo X200 Pro can this stencil be used for?
A: It is primarily used for reballing chips like:
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CPU (central processing unit)
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RAM (memory ICs)
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PMIC (power management ICs)
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Other high-density BGA chips on the motherboard.
Q4: Is the stencil suitable for beginners?
A: This stencil is recommended for intermediate to professional technicians. Reballing high-density chips requires precision tools and experience in chip-level soldering.
Q5: What material is the stencil made of?
A: The Amaoe X200P-XB-012 stencil is crafted from premium stainless steel, offering:
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Heat resistance
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Precision laser-cut holes
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Long-term reusability
Weight |
0.005 |
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