JTX ZX-01 Iphone 15 Series Silicone Middle Layer Bga Reballing Platform Set

JTX ZX-01 Silicone Middle Layer Tin Planting BGA Reballing Platform Set for iPhone 15 Series
 

Key Uses of the JTX ZX-01 Silicone Middle Layer BGA Reballing Platform

1. Reballing IC Chips:

   • The platform securely holds BGA IC chips in place during the reballing process.
   • Ensures proper alignment for solder ball replacement on IC chips.

2. Repairing Logic Boards:

   • Used when repairing or replacing damaged chips on the iPhone 15 series logic board.
   • Helps to maintain the correct positioning of components during soldering.

3. Heat Protection:

   • The silicone material acts as a heat-resistant layer, protecting surrounding components from heat damage during reballing or soldering.

4. Precise Work on Small Components:

   • Provides a stable and accurate platform to handle the tiny IC chips found in modern iPhones, ensuring precision in repairs.

5. BGA Stencil Compatibility:

   • Compatible with BGA stencils, allowing technicians to apply solder balls to the chip with accuracy.

Package includes:

• 1 x Module Fixture

• 3 x Stencil