KAISI-A11 3D STENCIL

Feature:

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• Stepped groove design enables stencil to align with tinning position of IC rapidly.
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• The square holes design makes it easier to take out the formed solder balls.
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• This 3D stencil is easy to use no matter you are a new or expert.
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• High success rate of planting tin,the solder balls can be formed once after you are proficient.
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• This 3D planting stencil is thicker than ordinary stencil in the market.Less tendency of deformation makes its using life be longer.
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