KAISI-A11 3D STENCIL
\n\nFeature:
\n\n- \n
- Stepped groove design enables stencil to align with tinning position of IC rapidly. \n
- The square holes design makes it easier to take out the formed solder balls. \n
- This 3D stencil is easy to use no matter you are a new or expert. \n
- High success rate of planting tin,the solder balls can be formed once after you are proficient. \n
- This 3D planting stencil is thicker than ordinary stencil in the market.Less tendency of deformation makes its using life be longer. \n
Weight |
0.01 |
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