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KAISI-A11 3D STENCIL
Feature:
- The stepped groove design enables the stencil to align with the tinning position of the IC rapidly.
- The square hole design makes it easier to take out the formed solder balls.
- This 3D stencil is easy to use no matter if you are a new expert.
- The high success rate of planting tin, the solder balls can be formed once you are proficient.
- This 3D planting stencil is thicker than ordinary stencils in the market. Less tendency of deformation makes it's using usebe longer.
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| Weight |
0.01 |
|---|
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