Mobile
Repairing Tools
Touch/Glass/OCA Glass
Stencils &
IC
OCA Machine &
Parts
Mobile
Accessories
Software
OCA
Sheets &
Polarizers
KAISI-A11 3D STENCIL
Feature:
- The stepped groove design enables the stencil to align with the tinning position of the IC rapidly.
- The square hole design makes it easier to take out the formed solder balls.
- This 3D stencil is easy to use no matter if you are a new expert.
- The high success rate of planting tin, the solder balls can be formed once you are proficient.
- This 3D planting stencil is thicker than ordinary stencils in the market. Less tendency of deformation makes it's using usebe longer.
| Weight |
0.01 |
|---|
Comments
Customer Reviews