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The MECHANIC AMAOE 6G/6P Stencil is a premium-quality BGA reballing stencil specially designed for iPhone 6G and iPhone 6 Plus motherboard repair. Manufactured from high-grade stainless steel, this precision stencil ensures accurate solder ball alignment for CPU, IC, and chip-level rework. Its ultra-precise laser-cut holes provide consistent solder ball placement, making it an essential tool for professional mobile phone repair technicians. The durable construction resists warping under high temperatures, allowing repeated use without compromising performance. Ideal for mobile repair shops, service centers, and DIY electronics enthusiasts, the MECHANIC AMAOE 6G/6P stencil helps improve repair accuracy, reduce soldering errors, and achieve professional-quality reballing results. Â Â Â Overview
Key Features
Specifications
Specification
Details
Brand
MECHANIC AMAOE
Model
6G/6P
Product Type
BGA Reballing Stencil
Material
High-Quality Stainless Steel
Compatible Devices
iPhone 6G, iPhone 6 Plus
Application
CPU IC Reballing
Heat Resistance
Yes
Precision
Laser Cut
Reusable
Yes
Suitable For
Mobile Repair Professionals
MECHANIC AMAOE 6G/6P STENCIL
5 Bullet Points
| Weight |
0.010 kg |
|---|
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