MECHANIC AMAOE 6G/6P STENCIL

Product Description

The MECHANIC AMAOE 6G/6P Stencil is a premium-quality BGA reballing stencil specially designed for iPhone 6G and iPhone 6 Plus motherboard repair. Manufactured from high-grade stainless steel, this precision stencil ensures accurate solder ball alignment for CPU, IC, and chip-level rework.

Its ultra-precise laser-cut holes provide consistent solder ball placement, making it an essential tool for professional mobile phone repair technicians. The durable construction resists warping under high temperatures, allowing repeated use without compromising performance.

Ideal for mobile repair shops, service centers, and DIY electronics enthusiasts, the MECHANIC AMAOE 6G/6P stencil helps improve repair accuracy, reduce soldering errors, and achieve professional-quality reballing results.

Specifications

Features

• Precision laser-cut stencil holes
• Premium stainless steel construction
• Heat-resistant and deformation resistant
• Accurate IC solder ball positioning
• Reusable professional repair tool

Benefits

• Produces precise solder ball alignment
• Reduces rework and soldering mistakes
• Improves motherboard repair efficiency
• Long-lasting professional quality
• Suitable for daily repair shop use
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5 Bullet Points

• Precision laser-cut BGA reballing stencil.
• Durable stainless steel construction.
• Designed for iPhone 6G and 6 Plus.
• Heat-resistant for repeated professional use.
• Accurate IC solder ball alignment.