Mechanic/Amaoe MZ-3 Stencil
The Mechanic/Amaoe MZ-3 is a professional-grade BGA reballing stencil meticulously engineered for the Samsung Galaxy S9, S9+, and Note 9 series. This stencil is a staple for micro-soldering technicians, specifically designed to handle both Exynos 9810 and Snapdragon 845 chipset architectures.
With its signature matte black anti-glare finish and high-precision square-hole layout, it ensures consistent solder ball formation while reducing technician eye fatigue under microscope lighting.
Technical Specifications
| Feature | Details |
| Brand | Mechanic / Amaoe (Joint Venture Series) |
| Model | MZ-3 |
| Material | Japanese High-Strength Stainless Steel |
| Surface Finish | Matte Black Anti-Reflective Coating |
| Thickness | 0.12mm (Industry standard for precision) |
| Hole Geometry | Laser-Cut Square Holes (Prevents paste "sticking") |
| Primary Compatibility | Samsung Galaxy S9 / S9 Plus / Note 9 |
| Application | BGA Reballing / IC Tin Planting / Motherboard Repair |
Core Features & Benefits
The MZ-3 is distinguished by several engineering choices that elevate it above generic universal stencils:
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Heat Stability: Manufactured to withstand repeated thermal cycles from hot air stations without warping or "drumming" (bulging).
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Square Mesh Design: Unlike traditional round holes, the square-cut apertures provide better solder paste release, resulting in uniform solder balls and reducing the risk of bridges.
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Black Coating Technology: The specialized black finish absorbs light, providing a high-contrast view of the silver IC pads, which is critical for alignment under a microscope.
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1:1 Precision: Holes are CNC laser-etched to match the original factory pad layout of the Samsung S9/Note 9 logic boards.
Detailed Component Compatibility
The MZ-3 is a comprehensive "all-in-one" solution for the S9 generation of devices, supporting a wide array of integrated circuits:
| IC Category | Supported Components |
| Processors (CPU) | Samsung Exynos 9810 / Qualcomm Snapdragon 845 |
| Memory (RAM) | LPDDR4X / Stacked RAM modules |
| Power Management | Main PMIC, Sub-PMIC, and Battery Charging ICs |
| Network & Signal | Baseband CPU, RF Transceivers, WiFi/Bluetooth Modules |
| Storage (NAND) | UFS 2.1 Flash Memory chips |
| Audio & Sensors | Audio Codec, NFC Controller, and Display Driver ICs |

| Weight |
0.020 |
|---|

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