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The Mechanic/Amaoe MZ-3 is a professional-grade BGA reballing stencil meticulously engineered for the Samsung Galaxy S9, S9+, and Note 9 series. This stencil is a staple for micro-soldering technicians, specifically designed to handle both Exynos 9810 and Snapdragon 845 chipset architectures. With its signature matte black anti-glare finish and high-precision square-hole layout, it ensures consistent solder ball formation while reducing technician eye fatigue under microscope lighting. The MZ-3 is distinguished by several engineering choices that elevate it above generic universal stencils: Heat Stability: Manufactured to withstand repeated thermal cycles from hot air stations without warping or "drumming" (bulging). Square Mesh Design: Unlike traditional round holes, the square-cut apertures provide better solder paste release, resulting in uniform solder balls and reducing the risk of bridges. Black Coating Technology: The specialized black finish absorbs light, providing a high-contrast view of the silver IC pads, which is critical for alignment under a microscope. 1:1 Precision: Holes are CNC laser-etched to match the original factory pad layout of the Samsung S9/Note 9 logic boards. The MZ-3 is a comprehensive "all-in-one" solution for the S9 generation of devices, supporting a wide array of integrated circuits: Â Overview
Key Features
Specifications
Feature
Details
Brand
Mechanic / Amaoe (Joint Venture Series)
Model
MZ-3
Material
Japanese High-Strength Stainless Steel
Surface Finish
Matte Black Anti-Reflective Coating
Thickness
0.12mm (Industry standard for precision)
Hole Geometry
Laser-Cut Square Holes (Prevents paste "sticking")
Primary Compatibility
Samsung Galaxy S9 / S9 Plus / Note 9
Application
BGA Reballing / IC Tin Planting / Motherboard Repair
Detailed Component Compatibility
IC Category
Supported Components
Processors (CPU)
Samsung Exynos 9810 / Qualcomm Snapdragon 845
Memory (RAM)
LPDDR4X / Stacked RAM modules
Power Management
Main PMIC, Sub-PMIC, and Battery Charging ICs
Network & Signal
Baseband CPU, RF Transceivers, WiFi/Bluetooth Modules
Storage (NAND)
UFS 2.1 Flash Memory chips
Audio & Sensors
Audio Codec, NFC Controller, and Display Driver ICs
| Weight |
0.020 kg |
|---|
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