Mechanic/Amaoe MZ-5 Stencil
The Mechanic/Amaoe MZ-5 is a high-precision BGA reballing stencil designed specifically for professional electronics repair, targeting the Samsung S10 and S10+ series (Exynos and Snapdragon versions). It is widely recognized in the industry for its "black" anti-glare finish and square-hole design.
Below is the detailed product description organized for quick reference.
Technical Specifications Overview
| Feature | Details |
| Brand | Mechanic / Amaoe (Collaborative Series) |
| Model | MZ-5 |
| Material | High-Grade Japanese Imported Steel |
| Color/Finish | Specialized Matte Black Anti-Glare Coating |
| Thickness | 0.12mm (Ultra-thin for precision) |
| Hole Shape | Square-holed (Prevents solder paste bridging) |
| Compatibility | Samsung S10 / S10+ / Note 10 Series |
| Supported ICs | CPU, RAM, PMIC, Audio, WiFi, and Baseband chips |
Key Features & Benefits
The MZ-5 stands out due to its specific engineering choices that cater to micro-soldering professionals.
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Anti-Drum Design: The stencil is engineered to remain flat under high heat, preventing the "warping" or "popping" effect often seen in cheaper stencils.
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Square Mesh Holes: Unlike traditional round holes, the square design allows for easier release of solder paste, ensuring uniform solder balls across the entire BGA grid.
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Heat Resistance: Rated for high-temperature stability, allowing for repeated use without deformation.
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Laser Cutting Technology: Each hole is laser-cut with high precision to ensure 1:1 alignment with the original chip pads.
Detailed Chip Compatibility List
The MZ-5 is a "multi-purpose" stencil for the S10 generation. It covers almost every major integrated circuit on the logic board.
| IC Category | Components Supported |
| Processors | Exynos 9820 / Snapdragon 855 |
| Memory | LPDDR4X RAM / UFS 2.1 & 3.0 Storage |
| Power Management | Main PMIC, Sub-PMIC, and Charging ICs |
| Connectivity | WiFi/Bluetooth Module, NFC Controller |
| RF/Signal | Baseband Processor, RF Transceivers, Power Amplifiers |
| Audio/Misc | Audio Codec, Sensors, and Display ICs |
Usage Recommendations
To maximize the lifespan of your MZ-5 stencil and ensure a successful reballing process, follow these professional guidelines:
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Alignment: Ensure the IC is perfectly aligned using a microscope. The black coating helps provide high contrast against the silver pads.
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Solder Paste: Use high-quality solder paste (e.g., Mechanic 183°C or 138°C depending on the component sensitivity).
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Heat Application: Apply heat evenly in a circular motion. Because the stencil is 0.12mm thin, it reaches temperature quickly.
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Cleaning: Clean immediately after use using PCB cleaner or ultrasonic cleaning to prevent solder paste from hardening in the square holes.

| Weight |
0.020 |
|---|

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