2UUL DA67 Phone 15/15Plus Series Sealant Thermal Press Plate (2pcs/pack)

The 2UUL DA67 Sealant Thermal Press Plate is a precision-engineered accessory designed specifically for the iPhone 15 and 15 Plus series. In modern micro-soldering, the removal of protective underfill and factory sealants from the logic board is a high-risk procedure. This thermal press plate is designed to provide uniform, consistent pressure and heat distribution, allowing technicians to soften adhesives safely without causing thermal shock or mechanical stress to the delicate BGA (Ball Grid Array) components.

By ensuring a perfectly flat contact surface, the 2UUL DA67 helps professionals achieve cleaner removal of chips, reducing the likelihood of pad tearing or board delamination. This set includes two plates, ensuring durability and readiness for high-volume repair environments.

Technical Specifications

Key Features & Benefits

• Custom-Molded Geometry: The DA67 plates are precision-machined to match the specific layout of the iPhone 15 and 15 Plus logic boards, ensuring that pressure is applied only where needed without disturbing adjacent sensitive components.

• Uniform Heat Conductivity: The high-grade alloy material ensures that thermal energy from your heat gun or pre-heater is distributed evenly across the IC surface, preventing "hot spots" that could damage the chip or the PCB.

• Enhanced Chip Safety: By maintaining downward pressure during the sealant softening process, the plate prevents the IC from lifting prematurely or shifting, which is critical for maintaining alignment during reballing or rework.

• Durability and Longevity: The anti-corrosive, non-stick coating prevents flux and adhesive residues from bonding to the tool, ensuring a long operational life even with daily use in high-flux environments.

• Optimized for Professionals: Designed for use under trinocular microscopes, the low-profile design ensures minimal obstruction of the technician's line of sight, promoting better accuracy and reduced eye fatigue.

• Streamlined Workflow: Including two plates in the pack allows technicians to prepare multiple boards simultaneously or keep a spare on hand, maximizing repair turnaround times.

Usage Guidelines for Professionals

1. Preparation: Clean the motherboard surface thoroughly to remove any surface-level debris or old flux before positioning the thermal press plate.

2. Alignment: Place the 2UUL DA67 plate precisely over the target IC (CPU, NAND, or PMIC). Ensure that it sits flush against the surface.

3. Heat Application: Apply heat using a professional-grade hot air station. The thermal plate will absorb and distribute the heat uniformly, softening the underfill sealant effectively.

4. Sealant Removal: Once the sealant reaches a tacky consistency, use a precision blade or scraping tool to clear the edges. The plate will provide the necessary stability to keep the chip grounded while you work.

5. Post-Process: After the chip is removed or cleaned, allow the plate to cool completely before cleaning it with high-purity isopropyl alcohol (IPA) to maintain its non-stick surface integrity.

Note: Always utilize high-quality ESD-safe tweezers and professional magnification tools when working with the 2UUL DA67. The plate is designed to work in conjunction with consistent, controlled heat sources; do not exceed the thermal limits of the motherboard substrate.