2UUL PH11 HOT-BLOCK Preheater for PCB Delamination Rebonding

• High-quality 2UUL PH11 HOT-BLOCK preheater designed for professional motherboard repair

• Specially used for PCB delamination rebonding and layered board separation

• Provides even and controlled heat to avoid overheating sensitive components

• Helps loosen glue and solder layers before CPU, baseband, or IC rework

• Improves bonding strength during rebonding and re-lamination process

• Compatible with most smartphone motherboards (iPhone & Android)

• Compact, durable design suitable for repair shops and labs

• Enhances repair efficiency and reduces failure rate

• Must-have equipment for chip-level mobile repairing