KAISI-A8 3D STENCIL
- The stepped groove design enables the stencil to align with the tinning position of the IC rapidly.
- The square hole design makes it easier to take out the formed solder balls.
- This 3D stencil is easy to use no matter if you are a new or expert.
- With the high success rate of planting tin, the solder balls can be formed once you are proficient.
- This 3D planting stencil is thicker than ordinary stencils in the market. Less tendency of deformation makes its use life be longer.