KD PPD PASTE 183°
Feature:
1. New technical support and unique chemical formula provide excellent wetting, to ensure high reliability.
2. Adapted to the mobile phone repair industry, computer digital service industries, and high-precision circuit board soldering SMT/BGA soldering processes.
3. The viscosity is moderate, there is almost no patch collapse, and the components do not shift.
4. Good wettability & Good weldability High-end quality, a unique formula, perfect performance.
5. Suitable for a variety of welding environments, and a wide range of applications, with high compatibility.
6. The storage time is up to 12 months in a refrigerated environment. Unique high-quality solder tin paste(the best configuration ingredients: Sn42/Bi58) makes the adhesion long-lasting, it is not easy to dry, and the viscosity time is up to 48 hours.
7. The residue is colorless and transparent, does not affect the detection, is disposable, and has excellent cleaning performance.
8. Use of efficient energy thixotropic agents, printing and preheating collapse, and special solder ensure a good printing and fine pattern.
9. Uncompromising performance in an ultra-light ultra body, heavyweight performance without the weight. Fine and flexible packaging, delicate appearance.
Packing Details:
- * 1xKD BGA SOLDER PASTE (183°)
Weight |
0.03 |
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