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MAANT MY-224-OR (10CC) BGA Soldering Paste is a high-performance, lead-free solder paste designed for BGA (Ball Grid Array) and fine-pitch component soldering. It offers excellent printing, reflow, and tackiness properties, ensuring reliable solder joints. Ideal for high-precision applications in electronics manufacturing, it provides consistent, stable performance. Compact 10CC size, ideal for precision soldering tasksOverview
Feature
Details
Brand
Maant
Product Name
MY-224-OR BGA Soldering Paste
Volume
10CC
Color
Light Yellow (varies by batch)
Type
Lead-free BGA soldering paste
Suitable For
BGA (Ball Grid Array), fine-pitch components, electronics assembly
Drying Time
Non-drying, stable during reflow process
Finish After Drying
Smooth, reliable solder joints without hardening
Bottle/Tube Design
Easy-apply syringe for precise application
Non-Corrosive
Yes, safe for all electronic components
Durability
Excellent performance at high temperatures, long-lasting
Portability
| Weight |
0.030 kg |
|---|
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