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Maant My-224-Or 10cc Bga Soldering Paste
MAANT MY-224-OR (10CC) BGA Soldering Paste is a high-performance, lead-free solder paste designed for BGA (Ball Grid Array) and fine-pitch component soldering. It offers excellent printing, reflow, and tackiness properties, ensuring reliable solder joints. Ideal for high-precision applications in electronics manufacturing, it provides consistent, stable performance.
| Feature | Details |
|---|---|
| Brand | Maant |
| Product Name | MY-224-OR BGA Soldering Paste |
| Volume | 10CC |
| Color | Light Yellow (varies by batch) |
| Type | Lead-free BGA soldering paste |
| Suitable For | BGA (Ball Grid Array), fine-pitch components, electronics assembly |
| Drying Time | Non-drying, stable during reflow process |
| Finish After Drying | Smooth, reliable solder joints without hardening |
| Bottle/Tube Design | Easy-apply syringe for precise application |
| Non-Corrosive | Yes, safe for all electronic components |
| Durability | Excellent performance at high temperatures, long-lasting |
| Portability |
Compact 10CC size, ideal for precision soldering tasks |
| Weight |
0.030 |
|---|
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