MAXX GOLD MAX FIX SOLDRING PASTE

\n\nFeature:\n\n1.Good adhesion. Paste delicate, particles small, only 20~38 microns.\n2.Excellent wet ability. After opening, the surface remains moist for 36 hours. Does not affect the welding.\n3.Lead solder paste, 183 ?, the degree of melting point, easy welding, easy molding\n\nApplication:\nMobile phone chips repair, computer and digital service industries, high-precision circuit board SMT soldering, BGA welding process, etc Solder paste lead solder at room temperature melting point 183 ? / forming fast and easy to weld conductive\n\n \n\n