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MECHANIC MICRO-CARVING LASER MACHINE
MECHANIC Micro-Carving Laser Machine | Professional Precision Series
The MECHANIC Micro-Carving Laser Machine is a high-performance, industrial-grade solution designed specifically for the precision electronics repair industry. Engineered for tasks ranging from back glass removal to personalized component engraving, this machine integrates advanced fiber laser technology with an intelligent software ecosystem. It provides repair technicians with a non-contact, high-efficiency method to handle delicate operations on modern smartphones and tablets.
Technical Specifications & Feature Overview
| Feature Category | Detailed Specification | Functional Benefit |
| Laser Type | High-Frequency Fiber Laser Source | Ensures stable output and ultra-fine beam quality for intricate micro-carving. |
| Wavelength | 1064nm | Optimized for metal marking and breaking down cold-press glass adhesives. |
| Marking Range | 175mm x 175mm | Spacious enough for all modern smartphone models and small tablet components. |
| Positioning System | Red Light Focus & Dual-Dot Alignment | Allows for rapid, millimeter-precise calibration of the workpiece height. |
| Operating System | Dedicated Intelligent Control Software | Includes a vast library of phone blueprints (drawings) with cloud updates. |
| Cooling Method | Built-in High-Speed Air Cooling | Permits continuous operation without the risk of thermal shutdown or degradation. |
| Power Supply | AC 110V - 220V (Universal Compatibility) | Versatile for international repair labs and service centers. |
| Construction | Heavy-duty Aluminum Alloy Chassis | Provides a vibration-free environment essential for high-speed engraving. |
Core Functional Capabilities
1. Back Glass Removal & Refurbishment
One of the primary applications for the MECHANIC Laser is the efficient removal of back glass on flagship devices. The laser penetrates the glass to target the adhesive layer underneath. By carbonizing the glue, the glass can be removed safely without damaging internal components like wireless charging coils or flexible cables.
2. IC & Shielding Cover Etching
For advanced motherboard repair, this machine can be used to precisely etch or mark IC chips for identification or to weaken shielding cans for easier removal. The micro-carving precision ensures that the surrounding PCB remains untouched.
3. DIY Personalization & Branding
Beyond repair, the machine serves as a branding tool. It can engrave high-definition logos, text, or serial numbers onto metal frames, plastic housings, and leather accessories, providing a premium "custom" service for customers.
Key Advantages for Repair Professionals
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Non-Contact Operation: Unlike manual scraping or heat guns, the laser eliminates the risk of physical stress or heat soak on sensitive internal hardware.
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Speed & Efficiency: What typically takes 45 minutes of manual labor can be reduced to a 10-15 minute automated process.
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Precision Blueprinting: The included software is frequently updated to include new models (iPhone, Samsung, Huawei, etc.), ensuring the laser path never hits the camera lens or sensors.
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User-Friendly Interface: One-button start and automatic focusing minimize the learning curve for technicians.
| Weight |
12 |
|---|
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