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MECHANIC S24 ANDROID STENCILS SET 25 IN 1
Stencil Purpose: Stencils are used for the precise application of solder paste to solder pads on a PCB. This solder paste serves as a temporary adhesive that holds surface-mount components (SMDs) in place during the soldering process.
Reballing: Stencils are also commonly used in reballing processes, which involve removing and then re-soldering a component, such as a BGA (Ball Grid Array) chip. The stencil helps apply solder balls to the component's pads with precision.
Compatible Devices: The stencil is likely designed for use with specific models. Each stencil is typically designed to match the component layout of a particular device or series.SET 24 IN 1
S24-53
S24-40
S24-50
S24-55
S24-28
S24-80
S24-54
S24-44
S24-87
S24-49
S24-45
S24-52
S24-68
S24-74
S24-33
S24-36
S24-39
S24-73
S24-27
S24-35
S24-57
S24-23
S24-78
S24-75
S24-VS04
| Weight |
0.400 |
|---|
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