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₹429 86% Off ₹800

* Excellent capacity of solder-stickiness

* 100% brand new and high-quality Excellent capacity of solder-stickiness

* Type: Mechanic UV559

* Excellent Anti-wet Capacity

* Widely used on BGA, PGA, CSP packages, and Flip Chip Operation

* No-clean and Lead-free for Environmental protection

* Suitable for multiple PCB Reflow

* Good Immersion

* Volume: 100 gram


Product Features

  • Professional advanced OEM RMA-559 BGA soldering paste flux+squeeze tube +free needle tip.

  • 100% new brand and high quality.

  • Good immersion and high-intensity joint.

  • Easy to peel off with hands or tweezers, leave no residue.

  • Won’t oxidate gold, copper, phosphorus, or bronze, oxidation.

  • Prevent contamination during assembly.

  • RMA-559: high viscosity no-clean flux, reprocessing PCB, BGA, PGA, for soldering computer/phone chips.

  • RMA-559 is a mixture of high-quality alloyed powder and resinic pasty flux, it can avoid the pale yellow residue.

  • High soaking? high-strength joints.

  • Non-toxic, non-corrosive, strong ability of insulation.

  • Good insulation and smooth welding surface.

  • No deterioration no dryness.

  • No poison no corrosion, no damage to parts.

Product Specifications

  • Flux Type: RMA-559
  • Volume: 100gm
  • Dimension: 93 x 33 x 23mm
  • Material: the mixture of high-quality alloyed powder and resinic pasty flux, can avoid the pale yellow residue.
  • Color: Yellow
  • Insulated: Yes
  • With Needle Tip: Yes
  • Application: for soldering and reballing of computer and phone chips.
  • Advantage:  Good immersion and high-intensity joint.
  • Function:  for PCB, BGA, and PGA reworking.
  • 100%: New Type, high quality.





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