MECHANIC XZ10 0.35mm SOLDER BALL 10000 PCS

Features:

MECHANIC XZ10 0.35mm solder ball Have Lead Welding Tin Bead Motherboard Chip Hard Disk Baseband Repair Soldering Tin Ball Repair Tools The BGA solder ball has the following characteristics:

The BGA solder ball has the following characteristics:

• MECHANIC solder ball 10000PCS/Bottle
• Composition: Sn63/Pb37 ( 63% tin /  37% lead )
• Meet EU ROHS and REACH standards.
• With high reliability, excellent mechanical properties, good thermal fatigue resistance, and oxidation resistance.
• Purity and sphericity are very high, with no surface defects.
• Suitable for BGA, CSP, and other cutting-edge packaging technology and the use of micro-welding.
• The minimum diameter of the solder ball is 0.35mm, non-standard sizes can be customized according to customer requirements.
• When using the automatic calibration with the ability and allow the placement of a relatively large error, unprovoked surface flatness problems.

Package Content

• 1x MECHANIC XZ10(0.35mm) Solder Ball - 10000 Pieces (0.35mm)