Relife RL-404 40g 138°C Low-Temperature Melting Point Lead-free Tin Paste for Mobile Phone BGA Repair

Relife RL-404 40g 138°C Low-Temperature Melting Point Lead-free Tin Paste for Mobile Phone BGA Repair

Name: Relife RL-404 40g 138°C Low-Temperature Melting Point Lead-free Tin Paste for Mobile Phone BGA Repair
Brand: Relife
SKU: 1957
Price: 234.00 INR
Availability: InStock

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₹234 ₹400/pcs 42% off

1. A low temperature lead-free solder paste customized for high-end motherboard repair

2. Tin lighting / climbing tin strong / high purity / temperature standard / easy to store

3. Low temperature tin paste melting point temperature

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4. Low melting point

5. Effective protection of circuit board components

6. Backed by value tin technology

7. Not only the skilled craftsmanship, but also need

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In stock ·Brand Relife ·SKU 1957

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Overview

RELIFE RL-404 Lead-free Solder Paste Low-Temperature Melting Point 138 Degrees Tin Paste Phone PCB BGA/SMD Template Repair Tin

RELIFE RL-404 138° Soldering Paste is a specialized soldering paste with a 138° melting point, designed for efficient and reliable electronic soldering applications.

Meet the maintenance needs of motherboards for Samsung, Oppo, Vivo, Redmi and Apple, etc. high-end machines
A low-temperature lead-free solder paste customized for high-end motherboard repair
RL-404 138 ° C low-temperature solder paste

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