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RELIFE RL-404138° SOLDERING PASTE
RELIFE RL-404 Lead-free Solder Paste Low-Temperature Melting Point 138 Degrees Tin Paste Phone PCB BGA/SMD Template Repair Tin
RELIFE RL-404 138° Soldering Paste is a specialized soldering paste with a 138° melting point, designed for efficient and reliable electronic soldering applications.
- Meet the maintenance needs of motherboards for Samsung, Oppo, Vivo, Redmi and Apple, etc. high-end machines
- A low-temperature lead-free solder paste customized for high-end motherboard repair
- RL-404 138 ° C low-temperature solder paste
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| Weight |
0.05 |
|---|
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