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RELIFE RL-421-OR BGA FLUX PASTE

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₹124.98 60% Off ₹200

* The Solder Paste is a high viscosity no-clean flux, used for PCB, SMD, reworking

* Can be used for soldering and reballing of computer and phone chips It is a mixture of high-quality alloyed powder and resinic pasty flux, it can avoid the pale yellow residue

* Help to repair the circuit boards and protect the electronic components

* A necessary material for repairing the mobile phone mainboard

* High Insulation Resistance Suitable For Mobile Phone Pcb Cpu Repair

* Volume: 10cc

RELIFE RL-421-OR is a high viscosity lead-free solder paste designed for soldering and reballing SMD components and PCB.

  1. Imported rosin, no virtual welding, easy to tin
  2. The color is pure, with no impurities\n\n3. Running tin is fast and has less smoke\n\n4. High insulation resistance, suitable for mobile phone PCB, CPU repair

 

Introduction:

10CC RL-421-OR Strong activity BGA Flux Paste for PCB, SMD, BGA Reballing Soldering, Relife RL-421-OR Soldering Paste Flux can be used for soldering and reballing of computer and phone chips. It is a mixture of high-quality alloyed powder and resinic pasty flux, it can avoid the pale yellow residue. Help to repair the circuit boards and protect the electronic components. A necessary material for repairing the mobile phone mainboard

 

Features:

  • Imported rosin, no virtual welding, easy to tin.
  • The color is pure, with no impurities.
  • Running in is fast and has less smoke.
  • High insulation resistance, suitable for mobile phone PCB, and CPU repair.

 

Weight

0.05

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