Sunshine SS-101A IC Glue Removing Tools
Features:
- Elasticity is tougher, high-temperature resistance, no deformation, no sticky tin
- Using this tool to repair BGA chips, for example, baseband, CPU, etc. can have a multiplier effect with easy operation
- Using the best copper material after rolling, extruding, and drawing process
- Using good aluminum materials, rolling, polishing, and other processes,
- Breakthrough the traditional craftsmanship, the surface feels and internal hardness reach the best condition, light, and convenience.
- Carefully polished
- Pen-shaped design, breaking through the traditional polishing process.
- For mobile phone motherboards various small parts disassembly
Weight |
0.07 |
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