Mobile
Repairing Tools
Touch/Glass/OCA
Glass
Stencils &
IC
OCA Machine &
Parts
Mobile
Accessories
Software
OCA
Sheets &
Polarizers
YCS Professional PCB Pad Cleaning Brush for iPhone & Android
The YCS Professional PCB Pad Cleaning Brush is a specialized tool designed for precision electronics repair. Whether you are a professional technician or a DIY enthusiast, this brush is engineered to handle the delicate nature of iPhone and Android logic boards without causing static damage or physical abrasion.
Here is the full product description organized for quick reference.
Product Overview
| Feature | Specification / Detail |
| Product Name | YCS Professional PCB Pad Cleaning Brush |
| Primary Use | Removing residual solder, flux, and oxidation from PCB pads. |
| Compatibility | iPhone, Android, Tablets, and high-density micro-electronics. |
| Handle Material | Anti-static, heat-resistant composite / Aluminum Alloy. |
| Bristle Material | High-density Fine Steel Wire / Anti-static Synthetic Fiber. |
| Weight | Approx. 15g - 25g (Lightweight for precision work). |
| Length | Ergonomic "pen-style" length (Approx. 130mm - 150mm). |
Key Technical Features
| Component | Description & Benefit |
| Anti-Static (ESD) Safe | Designed to prevent electrostatic discharge which can fry sensitive IC chips and CPU components during cleaning. |
| Precision Bristles | The bristles are stiff enough to remove stubborn burnt flux but soft enough not to scratch the solder mask or pull up delicate pads. |
| Heat Resistance | Can be used safely near hot air rework stations or while the board is still warm from desoldering. |
| Slim Profile | The narrow head allows for cleaning in tight spaces, such as under-fill removal around BGA chips. |
| Ergonomic Grip | Textured handle provides a non-slip grip, essential for high-magnification work under a microscope. |
Application & Usage
| Task | How the YCS Brush Helps |
| BGA Reballing | Cleans the "motherboard side" pads after chip removal to ensure a perfectly flat surface for the new chip. |
| Flux Removal | Works effectively with Isopropyl Alcohol (IPA) to scrub away sticky residue after soldering. |
| Oxidation Cleaning | Gently removes "black pads" or corrosion caused by liquid damage on mobile devices. |
| Glue/Underfill Scraping | Helps in the mechanical removal of softened epoxy underfill around iPhone CPUs. |
| Weight |
0.060 |
|---|
Comments
Customer Reviews
No Review Found